2026-10-27
A cerium-oxide-based rare earth polishing powder with a pH range of 7.0 to 8.0 is specified for precision optics and consumer-electronics cover glass. Product documentation describes a formulation that combines chemical decomposition and mechanical abrasion to improve surface finish and process efficiency. Its particle-size distribution and suspension behavior are presented as key controls for consistency in high-precision polishing.
Product specifications identify cerium oxide as the core material. The powder is described as offering faster polishing and higher processing efficiency than conventional materials, with lower material consumption per unit.
The combination of controlled particle size and dispersion is intended to support repeatable results across production runs while limiting maintenance demands associated with slurry handling.
Specifications list total rare earth oxide content above 99 percent and a CeO2/TREO ratio of 99.9 percent. The pH range is 7.0 to 8.0, the appearance is white, and the recommended specific gravity is 1.03 to 1.08.
| Item | Specification |
|---|---|
| TREO (total rare earth oxide) | >99% |
| CeO2/TREO | 99.9% |
| Particle size distribution (PSD) | D50=1.0–1.4 µm, D99<6 µm |
| pH | 7.0–8.0 |
| Appearance | White |
| Recommended specific gravity | 1.03–1.08 |
Applications include spherical lenses with grinding ratings of 80 to 120, prisms, motherboard substrates, and flat optical glass. The powder is also used for cover glass in smartphones and tablets.
Equipment compatibility is described as covering both flat and spherical polishing systems, allowing the powder to be used across different optical manufacturing setups.
Standard packaging is 25 kg polyethylene drums and 500 kg pallets. Custom packaging can be specified to match storage and logistics systems.
How should the recommended specific gravity of 1.03 to 1.08 be adjusted?
The specification depends on glass hardness, polishing-machine pressure, and rotation speed. A starting point of 1.05 is suggested, followed by small concentration adjustments based on surface-roughness measurements to reach the required removal balance.
Is the powder easy to clean after polishing?
The formulation includes optimized suspension aids intended to prevent stubborn deposition on workpieces. Conventional ultrasonic cleaning can remove residue without affecting later coating or inspection steps.
What is the significance of the D99 below 6 µm specification?
D99 describes the upper end of the particle-size distribution. Keeping it below 6 µm limits the presence of large particles that can cause deep scratches, supporting a high-gloss surface and low defect rate.
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